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Falcon 8500

8500 Oblique (Small)

Overview

Sikama’s 200mm reflow solder system is known as the Falcon 8500. Incorporating Sikama’s unique “thermal technology” based on conduction heating in combination with forced thermal convection, the 8500 has 1 load zone, 5 heat zones and 2 cooling zones. Each system includes automatic load and unload buffers with appropriate sensors providing SMEMA interface connection to link into automated production lines.

Prior to entering the heated zones, the temperature of the substrates is stabilized by virtue of the liquid-cooled load zone. Each heated zone has individual set point controls and gas flow controls that maintain platen temperature to within +/- 2 degrees C to ensure consistent and precise temperatures for reliable, repeatable profiles. The gas is introduced through tiny perforations in the conduction heating platens and enters the reflow chamber at the same temperature as that zone. The internal liquid-cooled zone(s) ensure a process cool-down in an inert atmosphere. Further cooling of the substrates is accomplished as the product exits into the liquid-cooled offload zone. The 8500 can be supplied to operate left to right or right to left (specify at time of ordering).

The system can be interfaced with a computer (customer supplied) for storing of profiles, monitoring of individual heat zone temperatures as well as speed and time controls and remote operation. Sikama offers an optional Windows XP/Windows 7 based software package for use with the Falcon systems. Extra thermocouple installation is available as optional equipment for use with a temperature profiler.

The Falcon 8500 is well suited for wafer bumping applications (3-8 inch diameter wafers) as well as accommodating a broad range of substrate materials, high mass components and fixtures. In addition, the Falcon 8500 reflow oven is an excellent tool for curing epoxies, is a powerful, highly efficient, cost effective system with high production capabilities and designed to minimize your initial capital outlay and production costs, increase yields, safeguard your product integrity and improve your bottom line.

Typical Specification

Specifications Falcon 8500SB Falcon 8500WB
Heating Zones 5 5
Cooling Zones 2 1
Load Zones 1 N/A
Total Number of Zones 8 6
Platen Size 8 in. W x 12 in. L 8 in W x 12 in L
Minimum Substrate Size N/A 3 inches
Maximum Substrate Size 8 in. W x 11 in. L 8 in W x 11 in L
Weight Limit N/A Approx. 2.5 lbs
Time Mode (Dwell & Travel Time) 15 seconds to 99 min. 59 sec. (per zone) 10 sec. – 99 min, 59 sec.
Temperature (Standard) Up to 420°C Up to 420C
Temperature Accuracy ± 2°C +/- 2C
Warm-up Time to 230°C 15 minutes 15 min. approx.
Coolant Flow 0.5 to 2 GPM .5 to 2 GPM
Alarms Over/Under Temperature, Gas Flow, Coolant Flow & Temperature, Motor Torque, SMEMA (or other) Interface Over/Under Temperature, Gas Flow, Coolant Flow and Temperature, Motor Torque, SMEMA (or other) Interface
Parts Flow (Specify When Ordering) In-Line: L to R or R to L L to R or R to L
Gas Consumption 0-600 cubic feet/hour (process dependent) 1000 CFH
O2 Level < 25 PPM (process dependent) <25 PPM (process dependent)
Voltage (Specify when Ordering) 200 to 240 VAC, 50/60 Hz, 1 or 3 Phase 200-240 VAC, 50-60 Hz, 1 or 3 Ph
Start-up Power (Kw) 10 kW @ 240 VAC 10kW @ 240 VAC
Power Consumption 50% duty cycle or less 50% Duty Cycle or less
Basic Unit Weight 750 Lbs. 750 lbs
Basic Unit Dimensions L 126 x W 28 x H 45 inches L 126 x W 28 x H 45 inches

L 140 with paddle adapters

Optional Equipment

Part# Description
9897 Uninterruptible Power Supply
7543 Software Package (Windows 98/2000/XP)
Kit Zero Down Time Kit (2 Years Minimum Support)

The Falcon 8000 series can also be equipped with Walking Beam Transport System.