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Falcon 1200 with Capacity to Process 12" Wafers
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SANTA BARBARA, California, USA, March 21, 2000 - : Sikama International, Inc. is proud to announce their latest reflow solder/curing furnace - the Falcon 1200. In keeping with the latest technologies and trends, the 1200 is capable of processing 12" wafers in a multi-zone, in-line system.
Incorporating Sikama's unique "thermal technology" based on conduction heating in combination with forced thermal convection, the 1200 contains 1 load zone, 7 heat zones and 2 cooling zones and includes automatic load and unload buffers with appropriate sensors providing SMEMA interface connection to link into automated production lines. The system may be operated with air, nitrogen or forming gas. The efficiency of operation and minimal use of electricity and gas are the result of Sikama's unique patented design for balanced heating and cooling that will increase yields, improve the bottom line and safeguard product integrity.
Falcon 1200 DatasheetCONTACT: , Sikama International, Inc.
118 East Gutierrez Street, Santa Barbara, Ca. 93101-2314
Phone: (805) 962-1000, Ext. 108
Fax: (805) 962-6100
