Gain more performance … Use less resources. Our unique thermal technologies and shuttle systems offer distinct advantages that increase productivity and decrease costs
Our unique thermal technology combines bottom-up conduction with top-down convection with precise zone by zone temperature calibration and atmosphere control for ultimate precision of your solder or curing process.
With multiple customizable heating and cooling zones each with individual temperature set-points and gas flow controls that ensures a consistent and precise environment for any part geometry or weight.
More Control
Uses conductive plus convective thermal technology with precise zone by zone temperature calibration and atmosphere control for ultimate precision of your solder or curing process.
More Flexibility
Accommodates the most demanding substrates, including high mass, tall height, and unique geometry.
Less Space
Allows maximum configurability to take up less manufacturing floor space.
Less Cost
Uses less electricity and atmospheric gas than the competition.
Our systems have been providing reliable and trusted service to top manufacturers in the electronics industry for over 40 years.
More service, less uncertainty
Sikama’s on-site lab offers complimentary on-site testing for our customers. Whether you send us your parts or visit our factory, we will ensure that our equipment is the perfect fit for your application.
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